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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Knocking Down the Bone Pile: Interposer Rework and Precision Solder Ball Attachment

10/28/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
An interposer is a thin substrate positioned between a semiconductor device, such as a BGA and PCBA, containing conductive features that allow electrical connections to be rerouted, recreated, or modified between the component and the PCB. Interposers may be manufactured from organic materials such as polyimide or FR-4, as well as silicon, glass, or other specialized materials. In PCB rework, they are most commonly used when the existing board design cannot easily be modified through conventional rework techniques.

IBM Teams Up with SAP to Help Businesses Modernize Operations and Advance AI-Readiness

10/12/2026 | IBM
IBM announced IBM Ready for SAP Solutions to help midsize and fast-growing organizations accelerate cloud ERP modernization, unify enterprise data, and establish an AI-ready digital core.

Compal Earns Two Honors for AI Transformation at Digital Transformation Awards

10/06/2026 | Compal Electronics Inc.
Compal Electronics continues to advance its AI transformation, deepening the use of AI across manufacturing and enterprise management, and its progress has once again earned strong external recognition.

North American Demand to Drive Enterprise SSD Price Gains in 4Q26

09/21/2026 | TrendForce
U.S. CSPs have recently upgraded their enterprise SSD demand forecasts over the past two weeks, according to TrendForce’s research.

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.
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