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FKN Systek now offers the S300 multiple-blade depaneling saw for singulating assembled PCBs. The saw uses a 2.95-inch (75 mm) diameter, 0.021-inch-thick diamond-coated cutting blade.
The PLC-controlled S300 can singulate up to 24 lines in one pass. The operator places the board to be cut onto the tooling plate, and a hold-down lid is placed on top of the panel. STI safety sensors are built into the lid, so operation automatically ceases if the lid is opened during the process.
A built-in dust extraction vacuum and external dust extraction line are provided for dust removal during the process and for board cleanup after singulation is complete.
Built to provide a stress-free method of singulating panels with sensitive surface-mount components close to the edge of the parting section, FKN Systek diamond-blade depaneling saws leave a smooth edge finish with minimal stress imparted to the PCB.
The saws can also be used to singulate PCBs without scorelines or PCBs with overhanging components on the parting line. Since the cutting depth can be set to cut only through the PCB itself, components that overhang the parting line remain intact.
