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Advanced Electronics Packaging Digest

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ERAYAK Advances Hybrid Power Strategy as Ruike Facility Nears Completion

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Erayak Power Solution Group Inc. announced progress in the manufacturing expansion of its subsidiary, Ruike Electronics (Wenzhou) Co., Ltd. , and in the development of its next-generation power products.

Qnity Showcases Next-Generation Electronics Solutions at electronica 2026

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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, will showcase a portfolio of advanced materials and solutions designed to address growing thermal, power, connectivity and reliability demands across AI infrastructure, semiconductor manufacturing, automotive and high-performance computing applications at electronica 2026.

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IMI Reports 9.8% Q3 EBITDA Growth on Data Center and Automotive Demand

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MacDermid Alpha to Showcase SiC Power Module Technology at electronica 2026

11/03/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.
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