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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Merlin Circuit Technology Re-Certified to ISO 14001

10/15/2026 | Merlin Circuit Technology
Merlin Circuit Technology has successfully achieved re‑certification to ISO 14001, reaffirming our commitment to responsible environmental management and continuous improvement across all manufacturing operations.

Foxconn Wins Double Recognition for Sustainability

10/02/2026 | Foxconn
Foxconn Technology Group has been awarded 2nd place in the manufacturing category of the "CommonWealth Sustainable Citizen Award" by CommonWealth Magazine in 2026 , achieving its best result ever.

TTM Technologies Completes Acquisition of Epiq Solutions

10/01/2026 | TTM Technologies
Through the close of the transaction, TTM adds a talented management and operational team focused on critical technologies in the long-cycle Aerospace & Defense end market, with strategic and complementary capabilities that TTM expects will bolster TTM’s long-term growth strategy.

Federal Electronics Adds Extended-Range Thermal Test Chamber

06/25/2026 | Federal Electronics
Federal Electronics, a leader in providing advanced electronic manufacturing services, announced the addition of a new in-house environmental test chamber designed to support the reliability, qualification, and validation requirements of high-performance electronic products.

Federal Electronics Expands Environmental Testing Capabilities with New Extended-Range Thermal Test Chamber

06/08/2026 | Federal Electronics
Federal Electronics, a leader in providing advanced electronic manufacturing services, announced the addition of a new in-house environmental test chamber designed to support the reliability, qualification, and validation requirements of high-performance electronic products.
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