Celebrating One Year of the Advanced Electronic Packaging Technology Council (ADEPT): From Momentum to Measurable Impact

Estimated reading time: 3 minutes

Nearly 15 months ago, we launched the Advanced Electronic Packaging Technology Council with a simple premise: the packaging challenges facing our industry are moving too fast—and spanning too many disciplines—for any single company, region, or segment to solve alone. What we’ve seen since then is proof that focused, industry-led collaboration can turn urgency into alignment, and alignment into action.

As we celebrate ADEPT’s first anniversary, here are the some of the achievements that defined our inaugural year and set the trajectory for what comes next. A cornerstone of ADEPT’s first year has been strengthening the IEEE Heterogeneous Integration Roadmap (HIR) with practical, industry-grounded input.

Advancing the IEEE Heterogeneous Integration Roadmap (HIR): Interconnect + Reliability + Automotive chapters 

Through an ADEPT led team, working hand-in-hand with industry members, ADEPT delivered two contributions by adding new sections to:

• HIR Chapter 22, Interconnects for 2D and 3D Architectures
• HIR Chapter 24, Reliability of Heterogeneous Integration (HI) Systems 

This work was recognized as a meaningful step in aligning component innovation with system performance and long-term reliability. In 2026, ADEPT is continuing to expand the section on PCB technologies roadmap in Chapter 22.

This year, the HIR team would like ADEPT to expand on Chapter 5 on Automotive, particularly around EV-related inverter packaging requirements, and initiated that effort—helping ensure the roadmap reflects the rapidly changing demands of electrification, higher power density, and reliability expectations in automotive platforms

A Year of Global Workshops: Converting Dialogue into Direction

ADEPT didn’t limit impact to documents. With ADEPT’s support, we built momentum through workshops across regions to convene experts, pressure-test assumptions, and translate shared problems into shared actions.

Key Sessions and Workshops

• North America, special session at ECTC (May 2025): The spark that helped initiate broader engagement in HIR roadmap and set the workshop model in motion
• Europe, dedicated Association hosted workshop (July 2025): Expanded collaboration and created a pathway toward formal collaboration platform with European Institutes and companies
• Taiwan, ADEPT special session at IMPACT (October 2025): One of the most visible inflection points of the year with a full house session of nearly 200 attendees which triggered development of in-country strategy
• Malaysia, dedicated Association hosted workshop (November 2025): Strengthened regional partnership and accelerated an in-country ecosystem vision

These workshops and events demonstrated that when the community is convened around the right technical priorities, the ecosystem responds—with people, investment, and organization.

Collaboration Formalized: MOUs that Enable Guidelines and Standards

The workshops didn’t end at “good discussion.” They produced follow-through structures—exactly aligned to ADEPT’s intent to enable industry guidance and explore pathways for guidelines/standards. As a direct result of the workshop in Malaysia, the Association signed an MOU with MIMOS, Malaysia’s national Applied Research and Development Centre to advance AEP through collaborative work on ecosystem engagement, strategic guidance, and standards and best practices. The Association is in negotiation with other partners globally, sparked by these workshops. These MOUs create continuity and demonstrate the commitment toward industry collaboration, the foundation on which ADEPT has grown.

Recognition and Contribution Across the Industry Community

ADEPT’s influence has also been reinforced through active participation across related industry venues and bodies:

• Council members contributed to the AEPD, broadening alignment and cross-pollinating best practices.
• Devan Iyer, the mind behind the creation of ADEPT, delivered an invited talk at the IEEE Electronic Packaging Society’s 2026 HIR Symposium, where the council’s work was highly appreciated.
• ADEPT engaged the broader community through participation on special session panels on Aerospace & Defense Electronics and EV and Autonomous Vehicle Electronics at APEX EXPO 2026.
• Dr. Ravi Mahajan, Intel Fellow and Director of Intel’s Technology and Pathfinding group and ADEPT Council member, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy.

Guidelines in Progress: The Year-One Bridge into Year Two

If year one was about momentum, year two is about conversion. Guideline/standard development is now in progress, directly inspired by the momentum of these roadmap and workshop activities. This is where ADEPT can deliver compounding value: not just identifying challenges but helping the industry converge on practical guidance that accelerates learning curves and reduces avoidable reinvention.

Looking Ahead 

As ADEPT enters its second year, we’re building on a strong foundation:

• Continuing the extension to IEEE HIR Chapter 22 with deeper coverage of PCB technology roadmap  
• Advancing IEEE/HIR Chapter 5 with greater automotive/EV packaging roadmap depth
• Driving guidelines/standard forward so the industry can move faster—with less reinvention and more alignment
• Converting MOUs and regional momentum into sustained working groups 

Thank You to the Community

To every ADEPT member and collaborator, thank you for showing what coordinated, cross-supply-chain technical leadership can deliver in just one year. We started with a council. In one year, we’ve built a platform, one that’s already shaping roadmaps, enabling guidelines, and expanding globally.

Happy First anniversary, ADEPT.

This blog was originally posted here.