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Advanced Electronics Packaging Digest

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Mobix Labs Secures $1M+ Follow-On Order for Threat-Detection Sensor Subsystems

09/17/2026 | BUSINESS WIRE
Mobix Labs, Inc. , a U.S.-based supplier of advanced connectivity and sensing solutions for national security, announced that it has received a multi-unit follow-on production order in excess of $1 million for advanced RF sensing subsystems from a leading security-technology provider.

GSME Joined TSMC OIP Value Chain Alliance in North America

09/16/2026 | PRNewswire
GS Microelectronics U.S., Inc. (GSME), a leading semiconductor solutions provider, announced it has officially joined TSMC's Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a member partner in North America.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.

KYZEN to Feature MICRONOX Chemistries at IMAPS Symposium 2026

09/15/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 28-October 1 at the Encore Boston Harbor in Everett, MA.

Tark Thermal Solutions Expands U.S. Operations with New Thermoelectric Technology Center

09/15/2026 | Tark Thermal Solutions
Tark Thermal Solutions (TTS), a global provider of innovative active thermal management solutions, is expanding its manufacturing, engineering and testing capabilities for thermoelectric components and systems in North Carolina with a move to a new facility in Durham, North Carolina, which will serve as TTS’ Global Thermoelectric Technology Center.
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