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Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history. For January through August 2026, cumulative revenue reached NT$127,426 million, up 19.89% YoY, also marking a record high for the same period.
Zhen Ding noted that, as seasonal demand strengthens, August revenue surpassed NT$20 billion, with overall business momentum continuing to accelerate. In addition to continued inventory build for new product launches by mobile communications customers, combined revenue from servers, optical modules, and IC substrates more than tripled YoY, representing a further acceleration from the prior period. These businesses have emerged as key contributors to the company’s revenue growth, demonstrating that Zhen Ding’s strategic investments in AI computing infrastructure, high-speed data transmission, and advanced semiconductor applications are increasingly translating into tangible revenue gains.
Looking ahead to the second half of the year, Zhen Ding expects business momentum to strengthen further as new consumer electronics products enter the traditional peak season, while AI servers, high-speed optical modules, and IC substrates continue to ramp. With both the seasonal upswing and high-end AI applications supporting growth, the company expects operating performance to remain on an upward trajectory. Meanwhile, Zhen Ding is accelerating the next phase of its high-end capacity expansion, with continued build-outs at its Huai’an, Shenzhen, and Thailand manufacturing sites to support growing demand for AI servers, high-speed optical modules, and other high-end applications. In addition, on September 3, subsidiary Leading Tech. announced plans to invest no less than RMB12 billion in a new advanced packaging substrate manufacturing base in Shenzhen, further strengthening the Group’s capacity footprint in AI and advanced semiconductor applications.
As shipments of 1.6T high-speed optical modules, high-end AI server boards, and IC substrates continue to ramp, alongside the development of next-generation products such as 3.2T solutions and the gradual addition of new capacity, Zhen Ding’s AI-related businesses are moving from the investment phase into a period of accelerated scale-up. At the same time, the company’s revenue mix continues to shift toward higher-end, higher-value-added applications, laying a stronger foundation for growth in 2027 and over the medium to long term.
