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As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.
At SEMICON Taiwan 2026, Indium Corporation® will highlight how its proven materials technologies help manufacturers address these challenges with established, production-ready solutions designed to shorten time to market, improve yield, and support the industry’s continued push toward power, performance, area, and cost (PPAC) optimization.
Taiwan is at the center of this transition, with its semiconductor ecosystem spanning leading-edge fabs, OSATs, OEMs, system manufacturers, and a growing advanced packaging infrastructure. As AI architecture becomes more complex, success increasingly depends on how effectively these parts of the ecosystem work together.
“The semiconductor industry is moving beyond the chip,” Ross Berntson, President and CEO of Indium Corporation said. “The next generation of AI depends on the entire system working together—from the package and interconnect to thermal management, power delivery, and manufacturing. Materials that are proven in production and ready to scale can make a meaningful difference in yield, time to market, and overall system performance.”
Enabling the AI Ecosystem
Indium Corporation will showcase a range of materials technologies supporting critical challenges across heterogeneous integration.
Among the technologies featured will be materials for fine-pitch microbump flip-chip assembly, including WS-641, as well as solutions supporting ball attachment and deionized (DI) water-cleaning processes. The company will also highlight patented Durafuse® LT solder alloy technology for demanding fine-pitch applications where reliability and warpage control are increasingly important.
As advanced packaging and AI systems continue to evolve, thermal management is becoming another critical system-level consideration. Higher power densities and increasingly thin bond-line thicknesses are placing greater demands on solder reliability and material performance, while no-clean and fluxless processes are becoming increasingly important for advanced packaging applications. Indium Corporation will highlight proven thermal interface solutions for reflowed solder TIMs (sTIMs), including approaches designed to address voiding, as well as compressible TIMs technologies and liquid-metal solutions backed by Indium Corporation’s established and expanding supply capabilities in critical materials such as indium, gallium, and germanium.
For liquid-cooled AI systems, thermal performance increasingly depends on the interface between the semiconductor device and the cold plate. Indium Corporation’s thermal technologies are designed to help enable efficient heat transfer while addressing mechanical challenges, such as warpage and reliability under power cycling.
These technologies illustrate a broader industry shift: materials are no longer simply components within an individual manufacturing process. They increasingly influence yield, reliability, manufacturability, time to market, and system-level PPAC performance.
“Customers need materials solutions they can trust to work in real manufacturing environments,” Berntson said. “The value is not only the material itself—it is the combination of proven performance, manufacturing experience, technical support, and the ability to scale with the customer’s needs.”
Indium Corporation’s presence at SEMICON Taiwan reflects its long-standing role in Taiwan’s semiconductor manufacturing ecosystem and its commitment to supporting the next generation of AI, advanced packaging, and system-level integration.
Visitors can meet with Indium Corporation technical experts at Booth I2416 during SEMICON Taiwan 2026 to explore materials solutions for advanced packaging, thermal management, and high-performance electronics manufacturing.
