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From Wafer-level Inspection to System-level Scaling: A Preview of the November Advanced Electronics Packaging Digest

11/11/2026 | I-Connect007 Editorial Team
From wafer-level inspection and precision dispensing to interconnected computing architectures and electronics designed for extreme environments, the November issue of Advanced Electronics Packaging Digest (AEPD) explores how increasing complexity is driving new approaches to performance, reliability, and process control.

Amkor Breaks Ground on Expansion in Gwangju

11/11/2026 | Amkor Technology
Amkor marked a new milestone in South Korea with a groundbreaking at in Gwangju. The expansion is the next phase of growth for a site that has been part of Amkor’s Korea operations since the 1990s, and it supports rising demand for advanced packaging in AI and accelerated computing.

Indium President and CEO Ross Berntson Receives Regional Businessperson of the Year Award

11/10/2026 | Indium Corporation
Indium Corporation President and CEO Ross Berntson has been named the 2026 Businessperson of the Year by the Greater Utica (New York) Chamber of Commerce, recognizing his leadership in advancing innovation, manufacturing excellence, workforce development, and community engagement.

Intel Advanced Packaging in New Mexico: The Fab Is Full

11/05/2026 | Sandoval Economic Alliance
Intel’s Rio Rancho campus has run out of fab space. “All of the fab space that we have is full or is in the process of being full,” said Katie Prouty, Intel’s New Mexico plant manager and site leader, at SEA’s partner breakfast on October 22.

IMI Reports 9.8% Q3 EBITDA Growth on Data Center and Automotive Demand

11/04/2026 | IMI
Integrated Micro-Electronics, Inc. reported continued earnings growth in the third quarter of 2026, alongside new power module packaging business for data center infrastructure and momentum in automotive camera programs.
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