Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

IMAPS Symposium 2026: The Premier Event for Microelectronics Advanced Packaging

09/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at the Encore Boston Harbor in Everett, Massachusetts.

Teledyne Surpasses 1,000 Space Imaging Sensors with NASA Roman Telescope Launch

09/01/2026 | BUSINESS WIRE
Teledyne Space Imaging, a leading supplier of space-qualified imaging sensors, focal plane arrays, and integrated camera systems, celebrated a major milestone following the successful launch of NASA's Nancy Grace Roman Space Telescope, which lifted off on August 30 aboard a SpaceX Falcon Heavy rocket from Kennedy Space Center in Florida.

Kulicke & Soffa Advances AI Infrastructure with CPO, Advanced Packaging

09/01/2026 | PRNewswire
Kulicke and Soffa Industries, Inc., a global leader in semiconductor and electronics assembly solutions, continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio, including Thermo-Compression Bonding (TCB) solutions which directly address emerging Co-Packaged Optics (CPO) applications.

Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026

09/01/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Luis Pan will discuss how precisely matching materials and assembly processes can positively impact yield and reliability at the Conference on Advanced Packaging Reliability Technology and Interconnect Materials (CPRIM) 2026, September 4, in Guangzhou, China.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in