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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart

09/04/2026 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart.

GÖPEL electronic Introduces New Multi Line AXI 3D-CT X-Ray Inspection System

09/03/2026 | GÖPEL electronic
For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels.

Inspectis Enhances BGA Inspection with New Robust Stainless-Steel Micro Probe

09/03/2026 | INSPECTIS AB
Inspectis AB has introduced a new Micro-Size Optical Probe Tip for its Ball Grid Array (BGA) Inspection System, offering improved image quality and a more robust design for inspection of solder joints beneath today’s increasingly small BGA packages.

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

08/26/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026, at the Center of Excellence Building within Binghamton University’s Innovative Technologies Complex in New York.

3 Key Takeaways From a New White Paper on Component Salvage

08/25/2026 | I-Connect007
Electronic waste is typically discussed in terms of recycling, but recycling is only one way to recover value from discarded electronics. In the white paper “Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste, and Ensuring Economic Reuse,” Nash Bell, president of BEST Inc., examines a different approach: harvesting high-value components from obsolete or superseded PCBs, reconditioning them, and putting them back into service.
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