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BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.
As AI infrastructure, automotive electronics, advanced packaging, and high-performance computing continue to demand increasingly complex PCB assemblies, manufacturers require vacuum reflow solutions that can eliminate solder voids without sacrificing productivity. The Aurora Vacuum Reflow Oven was designed from the ground up to meet these challenges, combining industry-leading process control with a high-throughput architecture optimized for volume production – including large boards and dual-lane configuration.
“Today’s electronics manufacturers need more than low voiding—they need consistent, repeatable production at scale,” said Rob DiMatteo, General Manager at BTU International. “Aurora Vacuum delivers the process stability, thermal precision, and production efficiency required to maximize yields while supporting the most demanding manufacturing applications, including large server boards.”
The Aurora Vacuum Reflow Oven incorporates several innovations that improve process performance while increasing manufacturing productivity:
- A spacious 24-inch vacuum chamber accommodates large-format PCBs (up to 24.4 x 28.0 in. (620 x 711 mm)) and dual-lane production, providing the flexibility required for today’s high-density, high-volume manufacturing environments.
- Soft-start vacuum control minimizes rapid pressure changes that can disturb components during evacuation, reducing process-induced defects and improving first-pass yield.
- An independently heated vacuum chamber maintains precise thermal conditions throughout the vacuum cycle, enabling superior profile control and optimized void reduction.
- A low-vibration conveyor and vacuum system provide exceptional stability for sensitive assemblies, reducing component movement throughout the reflow process.
- Three independent conveyors maximize throughput by allowing continuous product flow while maintaining precise process control.
- A lightweight titanium vacuum chamber delivers exceptional durability with low weight improving thermal responsiveness and maintenance access.
The Aurora Vacuum Reflow Oven is currently available in the 125N50 configuration featuring 10 heated zones prior to the vacuum chamber and 3 heated zones on the vacuum chamber to maintain vacuum chamber temperature, plus 2 panel heaters inside the vacuum to maximize thermal profile control, as well as 4 controlled cooling zones to minimize exit temperature even at high throughput.
The Aurora Vacuum Reflow Oven will be introduced at SEMICON Taiwan September 2-4, 2026 in Taipei, Taiwan in booth I-2516. Come to the booth, co-located with our representative, CohPros, to see this new system.
