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Electronics manufacturing is increasingly shaped by smart factory concepts, e-mobility, and the continuous expansion of 5G infrastructure. As requirements for precision, energy efficiency, and connectivity continue to grow, Rehm Thermal Systems will present its latest process solutions at Asia’s leading trade fairs in spring 2026. With appearances in China, South Korea, and India, the company is further expanding its presence in one of the world’s most dynamic electronics markets.
Nelson Chong, Sales Manager Rehm ASEAN, underlines the strategic relevance of these events:
“The Asian market is one of the key driving forces behind the global electronics industry. Trade fairs in China, Korea, and India are essential platforms for us to showcase our technological leadership in reflow soldering and conformal coating. Just as importantly, they allow us to engage directly with our customers and partners and to develop tailored solutions for the challenges of digital manufacturing.”
Trade fair highlights at a glance
productronica China, Shanghai (March 25–27, 2026)
At productronica China, the focus will be on future-oriented technologies such as AI, autonomous robotics, and power semiconductors. Rehm will present highly flexible systems including the Protecto series for precise dispensing and coating, the Vision series for reflow soldering, and the Condenso product line for vapor phase soldering. Equipped with optional formic acid technology that can be integrated directly into the process, these solutions are specifically designed to meet the demanding quality standards of the automotive and semiconductor industries.
Smart SMT & PCB Assembly (SSPA), Korea (April 1–3, 2026)
In South Korea, the emphasis is on maximum process stability and sustainability. At SSPA, Rehm will showcase advanced vacuum technologies. A key highlight is the Condenso system, which reliably solders even highly demanding assemblies at temperatures of up to 240 °C. Its patented injection process enables individual control of the soldering process and ensures precise profile management. An optional vacuum module delivers void-free solder joints either directly after soldering or as a pre-vacuum step.
productronica India, Greater Noida (April 8–10, 2026)
With the recent opening of its own subsidiary in Bengaluru, Rehm is further reinforcing its commitment to the fast-growing Indian market. At the trade fair in Greater Noida, the team will present solutions designed to support local manufacturers in scaling their production operations — from the cost-efficient VisionXC for nitrogen reflow soldering to fast-response service concepts enabled by the new local application center.
NEPCON China, Shanghai (June 2–4, 2026)
At NEPCON China in Shanghai, Rehm will present innovative reflow technology for electronics manufacturing. The spotlight will be on the VisionXP+ VAC with vacuum chamber. This system enables convection soldering under reduced pressure and reliably removes pores, gas inclusions, and voids directly after the soldering process. Visitors will experience powerful and efficient solutions designed to deliver maximum process reliability, outstanding quality, and sustainable manufacturing performance for modern electronics production in one of Asia’s most dynamic markets.
Beyond these events, Rehm continues to underline its strong presence across Mainland China and the ASEAN region through regular participation in other major industry trade fairs and specialist events. These include exhibitions such as NEPCON Shenzhen China, SEMICON Taiwan, and further electronics events throughout Asia, where Rehm maintains close dialogue with customers and partners while strengthening the visibility of its technologies in regional markets.
