Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Altamira Awarded $63 Million NOVASTAR Contract

11/10/2026 | Globe Newswire
Parsons Corporation announced that Altamira, a Parsons company, was awarded a task order supporting the National Air & Space Intelligence Center (NASIC) to support the development, delivery, maintenance, sustainment, and enhancement of capabilities within the Collaboration Collection under the Services of Common Concern (SoCC).

PCB Technologies Reports Q3 Revenue Growth and US$270M Order Backlog

11/10/2026 | PRNewswire
PCB Technologies, a global leader in advanced electronic and PCB manufacturing solutions, announced its Q3 2026 results: record sales, orders and backlog, with improved profitability.

3 Key Takeaways: Why Advanced Materials Are Shaping the Future of Electronics

11/10/2026 | I-Connect007
The electronics industry is facing a new generation of engineering challenges. AI, advanced packaging, high-performance computing, and compact devices are pushing the limits of traditional design approaches. Engineers face mounting pressure to increase performance, manage rising power densities, and ensure reliability as electronic systems become smaller and more complex. In the companion guide, Engineering What’s Next, Qnity expands on the discussions featured in its six-part On the Line With… Qnity: Engineering What’s Next podcast series.

RTX's Raytheon Advances Joint Reduced Range Rocket with Third Successful Test

11/09/2026 | RTX
Raytheon, an RTX business, demonstrated its DeepStrikeTM JR3 solution for the U.S. Army's Joint Reduced Range Rocket program during a third successful flight test.

EV Group Advances Qubit Scaling Through Advanced Packaging

11/09/2026 | PRNewswire
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is supporting quantum chip developers and manufacturers in addressing the complex manufacturing requirements associated with scaling quantum computing systems.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in