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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Bert Horner to Present Flying Probe Testing at Dallas SMTA Failure Analysis and Test Information Day

08/17/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that its President Bert Horner will share his extensive expertise in electronics manufacturing and test engineering at the Dallas SMTA’s upcoming Failure Analysis and Test Information Day, taking place Friday, September 4, 2026, from 11 a.m.-2:30 p.m. at Aboca’s Italian Grill in Richardson, Texas.

It’s Only Common Sense: The Golden Age of Electronics Manufacturing Has Already Begun

08/17/2026 | Dan Beaulieu -- Column: It's Only Common Sense
If you spend too much time reading headlines, you could easily come away believing that manufacturing is struggling, electronics is losing ground, and the best days of our industry are behind us. We hear about supply chain disruptions, labor shortages, geopolitical uncertainty, rising costs, or global competition. It is enough to make even experienced professionals wonder what comes next.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

08/13/2026 | Chetan Arvind Patil, Marvell Technology
For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

Koh Young Technology to Double Production Capacity as AI Server and Advanced Semiconductor Demand Grows

08/12/2026 | Koh Young
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, announced plans to expand its Yeoju production complex in Gyeonggi Province, Korea, with the construction of a second production center.

GlobalFoundries Reports Q2 2026 Revenue of $1.79B

08/11/2026 | GlobalFoundries
GLOBALFOUNDRIES Inc. (GF)  announced preliminary financial results for the second quarter ended June 30, 2026.
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