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At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’ Speedstack.
This gives PCB designers and fabricators the ability to model material performance as part of the stack-up design process, helping them make more informed decisions and design the right materials into their PCBs from the outset.
Ventec’s pro-bond and thermal-bond Bondply materials are non-reinforced dielectrics, available as Resin Coated Copper (RCC) and Resin Coated Film (RCF). By eliminating glass weave, they remove micro-Dk variability associated with traditional glass-reinforced materials, an increasingly important consideration for high-speed, fine-feature PCB designs.
As electronics continue to push towards higher speeds, greater density and improved thermal performance, the ability to evaluate material properties early in the design process is becoming increasingly important.
We’re pleased to be working alongside Polar Instruments to make this material data more accessible within the PCB design workflow, helping designers move from simply specifying materials to designing with their performance in mind.
