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Advanced Electronics Packaging Digest

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Suggested Items

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

Wistron Showcases at 2026 OCP Global Summit

10/13/2026 | Wistron
Wistron Corporation and Wiwynn Corporation are participating in the 2026 OCP Global Summit in San Jose, California, under the theme “Create AI Beyond Limits,” showcasing a range of AI solutions and technology applications. ​​​​

Qnity Expands Thermal Management Solutions for AI Memory Cooling

10/13/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced two new advanced memory cooling solutions leveraging Laird™ Graphite-over-Foam (GOF) and Laird™ Thermal Interface Material (TIM) technologies.

Indium Expert to Discuss Sintering Technology Standardization at IMAPS Autumn Germany 2026

10/13/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will discuss his work to develop industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026, October 15-16, in Munich, Germany.

For Cybersecurity Certification, a Pause Is Not a Pass

10/13/2026 | Thomas Graham, Ph.D., Redspin
Until July, contractors across the U.S. defense industry had circled Nov. 10 as a watershed date marking the planned start of Phase 2 of the Cybersecurity Maturity Model Certification rollout. CMMC is a Department of Defense initiative intended to validate that contractors have implemented the security requirements in the National Institute of Standards and Technology’s Special Publication 800-171 Rev. 2. For contractors who store, process, and/or transmit controlled unclassified information, implementation is not optional. Defense Federal Acquisition Regulation (DFARS) 252.204-7012 has been a contractual obligation since Dec. 31, 2017.
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