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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Viscom Inc. to Showcase Latest AI-Powered Inspection Solutions at SMTA Mexico 2026

08/27/2026 | Viscom Inc.
Viscom Inc., will present its latest AI-powered inspection solutions at SMTA Mexico 2026, taking place from October 7–8 at the Expo Guadalajara Salón Jalisco.

BTU International Launches Aurora Vacuum Reflow Oven for High-Volume Manufacturing

08/26/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.

Fresh PCB Concepts: Everything Your PCB Supplier Needs Upfront for Quoting

08/27/2026 | Team NCAB -- Column: Fresh PCB Concepts
After more than 40 years in PCB manufacturing, I've come to appreciate that every PCB begins long before the first sheet of laminate enters a press or the first hole is drilled. A PCB’s journey begins with a request for quotation (RFQ). I’ve been involved with documentation practices since the days of 4:1-scaled and Blue & Red-taped mylars. They all underwent photo-reduction and resizing to 1:1-scale film for manufacturing, and this became our tooling package. With new media and technology involved, this process has undergone many changes, but the focus on tooling can never waver. I have learned that the accuracy of the quotation is directly tied to the quality of the information received. 

Teledyne FLIR OEM Selected for U.S. Army DUTCH Award for Next-Gen Thermal Imaging

08/25/2026 | BUSINESS WIRE
Teledyne FLIR OEM, part of Teledyne Technologies Incorporated, announced it was selected to support the U.S. Army’s Delivering Unmatched Thermal Capability Hastened (DUTCH) initiative, led by the Office of the Assistant Secretary of War for Critical Technologies and the U.S. Army Combat Capabilities Development Command (DEVCOM) C5ISR Center, to enhance next-generation uncooled thermal infrared (IR) sensing for defense applications.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.
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