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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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BTU International Launches Aurora Vacuum Reflow Oven for High-Volume Manufacturing

08/26/2026 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the launch of the Aurora Vacuum™ Reflow Oven, a next-generation vacuum reflow platform engineered to deliver exceptional solder quality, maximum throughput, and higher manufacturing yields for advanced electronic assemblies.

Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

08/24/2026 | Coherent
Coherent Corp. , a global leader in photonics, announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.

Indium to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

08/20/2026 | Indium Corporation
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future” at PCIM Asia 2026, August 26-28, in Shenzhen, China.

Technica USA Announces Strategic Partnership with Rehm Thermal Systems

08/18/2026 | Technica USA
Technica USA is pleased to announce a new strategic partnership with Rehm Thermal Systems. Under the distribution agreement, Technica USA will represent Rehm throughout the Western and South-West Central regions of the United States.

Powering the Future: From Substrate to System—The Power Module Assembly

08/19/2026 | Brian Buyea -- Column: Powering the Future
If you ask 10 engineers what “assembly” means in electronics, you’ll likely get 10 variations of the same answer: placing components on a board and soldering them down. That definition might work for traditional PCB-based electronics, but in high-power, high-reliability systems, it falls short by a mile.
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