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Advanced Electronics Packaging Digest

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Sypris Receives Follow-On Award for Mission-Critical U.S. Navy Program Share

10/14/2026 | Sypris Electronics LLC
Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on award to manufacture and test electronic power supplies for a large, mission-critical U.S. Navy program.

AT&S Announces Early Redemption of 2022 Hybrid Bond

10/12/2026 | AT&S
AT&S will redeem its outstanding 2022 hybrid bond with a nominal amount of €350 million on 22 October 2026, the first available call date.

Airbus Delivers First Next-Gen Satellites to Eutelsat OneWeb

10/02/2026 | Airbus
Airbus Defence and Space has delivered 32 latest-generation OneWeb Low Earth Orbit (LEO) satellites to Eutelsat. The satellites are currently being prepared for shipment from Airbus’ constellation satellite production facility in Toulouse, France, ahead of an upcoming launch in the USA. This marks a major milestone in Eutelsat’s programme to renew and enhance the OneWeb constellation.

AT&S, Marvell Expand Collaboration for Next-Gen AI Infrastructure

09/22/2026 | AT&S
AT&S announced an expanded collaboration with Silicon Valley company Marvell Technology, a leading provider of data infrastructure semiconductor solutions, to increase advanced IC substrate capacity for next-generation AI and cloud infrastructure.

Viasat Selects Rocket Lab to Build GEO Satellite for U.S. Space Force Program

08/17/2026 | Globe Newswire
Viasat Inc., a global leader in satellite communications, today announced it selected Rocket Lab Corporation, a leading launch and space systems company, to build a satellite bus for the U.S. Space Force’s (USSF) Space Systems Command (SSC) under the Protected Tactical SATCOM-Global (PTS-G) program.
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