Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.

Top Five Enterprise SSD Vendors’ Revenue Nears $37.59B in 2Q26

09/01/2026 | TrendForce
NAND Flash suppliers are broadening their enterprise SSD product lines to boost profits and refine their offerings, according to TrendForce’s recent memory industry report.

Sypris Q2 Orders Rise 25% on Satellite, Deep Space Programs

08/18/2026 | Sypris Solutions Inc.
Orders increased 25% sequentially for the Company, driven by a 54% increase in bookings at Sypris Electronics for satellite and deep space programs, and subsea fiber-optic data network systems.

Top 5 NAND Brands' Revenue Jumps 77% QoQ in 2Q26; Micron Rises to 3rd

08/18/2026 | TrendForce
TrendForce’s latest NAND Flash industry research reveals that AI server demand remained steady in the second quarter of 2026—particularly for enterprise SSDs—resulting in a supply shortage across the NAND Flash market.

Foxconn Announces Q2 2026 Financial Results

08/12/2026 | Foxconn
Revenue in the April-June quarter reached NT$2.53 trillion, that alongside operating profit and net profit, all set new second-quarter records.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in