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Advanced Electronics Packaging Digest

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Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

SPARK Microsystems Expands European Distribution Network with Alcom Electronics

07/30/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced the expansion of its distribution channel in Northwest Europe, welcoming Alcom Electronics to SPARK’s partner network.

JLC Digital Manufacturing Achieves PCI DSS v4.0.1 Level 1 Certification

07/23/2026 | JLC Digital Manufacturing
JLC Digital Manufacturing has achieved Payment Card Industry Data Security Standard (PCI DSS) v4.0.1 Level 1 certification, the highest level of PCI DSS compliance.

MKS Inc. Named in U.S. News & World Report’s 2026-2027 Best Companies to Work For

07/23/2026 | MKS Inc.
MKS Inc. a global provider of enabling technologies that transform our world, was again recognized by U.S. News & World Report (“U.S. News”) as one of the 2026-2027 Best Companies to Work For.

STMicroelectronics Reports $3.49 Billion Net Revenue in Q2 2026

07/23/2026 | STMicroelectronics
ST reported second quarter net revenues of $3.49 billion, gross margin of 34.8%, operating income of $187 million, and net income of $222 million or $0.24 diluted earnings per share (non-U.S. GAAP1 gross margin of 35.2%, non-U.S. GAAP1 operating income of $269 million, and non-U.S. GAAP1 net income of $291 million or $0.31 diluted earnings per share).
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