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Advanced Electronics Packaging Digest

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Suggested Items

Flex Connections: Material Selection in Nickel vs. Copper Tabs

09/17/2026 | Zack Schaner -- Column: Flex Connections
Flexible printed circuits are being designed to do more than route signals. In many applications, the flex circuit must also provide robust electrical interfaces, mechanical reinforcement, and reliable transitions between the circuit and surrounding assemblies. One effective way to accomplish this is by integrating copper or nickel tabs directly into a flexible printed circuit.

Fujifilm to Showcase Semiconductor Materials and India Commitment at SEMICON India 2026

09/17/2026 | Fujifilm
Demonstrate its leadership in the semiconductor material ecosystem development space at Hall 1, Booth 623 from September 17–19 at Yashobhoomi,

Infineon to Sell NOR Flash and F-RAM Business to Winbond, Focus on Core Growth Areas

09/17/2026 | Infineon
Infineon Technologies AG announced that it has entered into a definitive agreement under which Winbond Electronics Corporation, a Taiwan-based global supplier of semiconductor memory solutions, will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at $1.12 billion on a cash and debt free basis.

Incap Estonia Supports Employee Well-Being Through Creative Workshops

09/17/2026 | Incap
From February to June, Incap Estonia organised a series of creative workshops for employees in cooperation with the local Saaremaa Supporting Education Centre.

BAE Systems Receives $16M to Qualify RH45® for Space Missions

09/17/2026 | PRNewswire
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments, Resourcing, and Execution directorate to demonstrate and qualify its radiation-hardened 45 nanometer (nm) technology.
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