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Advanced Electronics Packaging Digest

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Airbus, Unseenlabs to Develop France’s Future Military Signal Intelligence Satellites

09/11/2026 | Airbus
On the sidelines of the International Space Summit, Catherine Vautrin, France’s Minister for the Armed Forces and Veterans’ Affairs, announced that the Directorate-General for Armament (DGA) had awarded the CASSIOPÉE contract to Airbus Defence and Space as the lead contractor and its co-contractor Unseenlabs, thereby initiating the renewal of France’s space-based signal intelligence (SIGINT) capability.

Mobix Labs Secures Initial F-16 Component Order

09/11/2026 | BUSINESS WIRE
Mobix Labs, Inc., a U.S.-based provider of advanced electronic components and connectivity solutions for aerospace, defense and mission-critical applications, announced that it has secured its initial production order for components supporting the F-16 Fighting Falcon, one of the most widely operated frontline fighters in the U.S. Air Force.

FTG Named to the TSX30

09/11/2026 | Globe Newswire
Firan Technology Group, a leading provider of aerospace and defence electronic products and subsystems, announced that it has been named to the 2026 TSX30®, Toronto Stock Exchange's annual ranking of the top-performing companies listed on the TSX based on three-year dividend-adjusted share price performance.

Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

09/10/2026 | TPCA
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
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