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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Draper Breaks Ground on New Microelectronics Building in Lowell

10/14/2026 | Draper Laboratory
Draper recently held a groundbreaking ceremony for a new microelectronics building in Lowell, Massachusetts. The building will house Draper's Integrated Microelectronics Production & Advanced Chip Technology (IMPACT) Center.  

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.

From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

Kapta Space Raises $24M Series A, Secures Multiple Classified MTI Contracts

10/13/2026 | Kapta Space
Kapta Space, a developer of next-generation spaceborne radar payloads, today announced a $24 million Series A financing led by Washington Harbour Partners and co-led by Bison Ventures, with participation from MetaVC and a group of new and existing investors including MYDA Capital, Entrada Ventures, Aurelia Foundry, and Fitz Gate Ventures.

Jaltek Achieves Nadcap Accreditation Following Norautron Acquisition

10/13/2026 | Jaltek
Luton-based electronics design and manufacturing specialist Jaltek, recently acquired by Norautron AS, an international provider of advanced electronics manufacturing services, has achieved Nadcap accreditation.
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