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Advanced Electronics Packaging Digest

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Suggested Items

Mitsui Kinzoku to Invest ¥190 Billion in New Malaysia Copper Foil Plant

11/13/2026 | I-Connect007 Editorial Team
Mitsui Kinzoku Co., Ltd. has announced plans to invest approximately ¥190 billion ($1.2 billion) in a new copper foil manufacturing plant in Malaysia to meet growing demand from the AI and semiconductor industries.

UCIe Consortium Releases 4.0 Specification for System-Level Integration

11/13/2026 | BUSINESS WIRE
The Universal Chiplet Interconnect Express® (UCIe®) Consortium, the open standards group for interconnects between chiplets within a package, announced the release of the UCIe 4.0 Specification, taking the UCIe architecture beyond chiplet-level interface design to address key requirements for integrating multiple chiplets into a cohesive on-package system.

Smart Dental Retainers With Flex PCBs

11/12/2026 | Anaya Vardya, American Standard Circuits
The retainer is one of the least glamorous devices in medicine: a thin plastic shell that patients are told to wear and mostly forget about. That obscurity is exactly what makes it interesting to device engineers right now. The mouth is a warm, wet, chemically rich environment sitting inches from the brain, in near-constant contact with saliva, teeth, and soft tissue. It is also one of the few places on the body a person willingly places a custom-fitted object for hours at a stretch, night after night, without complaint.

Real Time with... SMTAI 2026: Dymax Introduces a Flexible UV Curing Adhesive for Electronics

11/12/2026 | Real Time with...SMTAI
Dymax's Doug Katze introduces Dymax 9016, a flexible UV curing adhesive and encapsulant developed for automotive electronics. He explains how the material accommodates thermal expansion, cures in seconds, and offers chemical resistance, with potential applications in aerospace, defense, and AI hardware.

Beyond Design: Inductance—The Silent Architect Driving SI and PI

11/11/2026 | Barry Olney -- Column: Beyond Design
Inductance is the quiet saboteur of high speed design. It doesn’t reveal itself the way impedance discontinuities do, nor does it leave the obvious clues that poor routing or inadequate stackups produce. Yet it shapes nearly every facet of signal integrity (SI) and power integrity (PI), influencing how energy moves, how noise couples, how timing shifts, and how the power distribution network (PDN) responds under dynamic load.
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