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Advanced Electronics Packaging Digest

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Suggested Items

Yamaha Robotics to Focus on Assembly and Inspection Innovations at EFX 2026 in Stuttgart

09/22/2026 | Yamaha Robotics
Yamaha Robotics will show visitors to EFX 2026, the Expo for Electronics Manufacturing, in Stuttgart from October 6-8, how advanced surface-mount automation helps companies grow their business and increase productivity.

USI Launches AI Smart Camera Solution to Accelerate Smart Manufacturing

09/14/2026 | USI
USI announced its next-generation AI Smart Camera solution, a comprehensive edge AI and vision platform that empowers manufacturers to accelerate digital transformation through AI-driven quality inspection, process automation, logistics optimization, and smart factory initiatives

Early Purchases Lift 2026 Smartphone Production Forecast to 1.07 Billion Units

09/09/2026 | TrendForce
Global smartphone production reached 275 million units in 2Q26, down 8% YoY, according to TrendForce’s latest smartphone industry research.

Koh Young Brings Smart AI Solutions and Expanded True 3D Inspection Portfolio to SMTA Guadalajara 2026

09/08/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will bring its Smart AI Solutions and a broad portfolio of advanced inspection technologies to the SMTA Guadalajara Expo & Tech Forum, October 7–8, 2026, at Expo Guadalajara in Guadalajara, Jalisco, Mexico.

Yunlin County, Foxconn Launch 'Document Brain' Smart Service

09/01/2026 | Foxconn
The Yunlin County Government and Foxconn Technology Group announced that they have jointly developed the "Document Brain" smart agent service, which has completed its initial phase and achieved fruitful results in improving the efficiency of government administration.
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