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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Building Consistent Reflow Results Across Automotive Manufacturing Sites

10/20/2026 | Miles Moreau, KIC
As automotive electronics production shifts among global locations, replicating a successful assembly process isn’t as simple as moving the equipment or copying a recipe. Miles Moreau of KIC talks with Nolan Johnson about the challenges of maintaining consistent reflow performance across different lines and facilities. They explore what manufacturers can learn from better process data, where optimization can make a difference, and why experienced engineers still play a critical role in getting the process right.

What It Takes to Test Automotive Power Electronics Assemblies

10/21/2026 | Francesca Pinto, SPEA

SMTA Launches Advanced Electronics Assembly Technologies Course

10/07/2026 | SMTA
The Surface Mount Technology Association (SMTA) announced a new Advanced Electronics Assembly Technologies course scheduled for November 10-12, 2026 from 9:00 AM to 1:00 PM US Central Time each day. Electronics industry veteran, Keith Bryant, instructs the course live via an online platform.

Indium, SMT Thermal Tech to Demonstrate Low-Temp Reflow Energy Savings

10/05/2026 | Indium Corporation
Indium Corporation® Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will explore how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing (EFX), October 6-8, in Stuttgart, Germany.

Synopsys Powers Autonomous Engineering with Long-Horizon Agents and Autopilot Platform

09/28/2026 | PRNewswire
Synopsys, Inc. announced Synopsys AgentEngineer™ solutions, the industry's broadest portfolio of domain-specific long-horizon agents that can reason, plan, and execute complete engineering workflows from silicon to systems across verification, system validation, implementation, analog, manufacturing, and simulation and analysis domains.
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