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Advanced Electronics Packaging Digest

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Flexible PCB Market to Reach $41.7 Billion by 2030, Growing at 12.3% CAGR

07/10/2026 | Globe Newswire
The Flexible PCB Market, valued at USD 23.3 Billion in 2025, is projected to reach USD 41.7 Billion by 2030, growing at a CAGR of 12.3%.

Rewiring Medical Brain-Machine Communication With Flex PCBs

07/09/2026 | Anaya Vardya, American Standard Circuits
Flex and rigid-flex PCBs are shaping the future through a range of innovative applications, including neural interface arrays that redefine brain-machine communication in the medical field. For decades, scientists and engineers have dreamed of tapping into this electrochemical symphony, and flex PCBs are finally making that dream clinically viable.

Amphenol Trackwise Announces Record-Breaking 100-Metre Multi-Layer Flexible Circuit for Industrial Customer

07/08/2026 | Trackwise
Amphenol Trackwise Designs, a global leader in the design and manufacture of advanced flexible printed circuit boards (PCBs), has announced the successful manufacture of a 100-metre-long multi-layer flexible circuit.

Flexible Barrier Films for Electronics Market Set for Strong Growth Through 2033

07/02/2026 | PRNewswire
The global flexible barrier films for electronics market is growing at a robust pace, expected to be valued at around US$ 400.3 million in 2026 and projected to reach US$ 1,104.4 million by 2033, registering a CAGR of 15.5% during the forecast period.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.
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