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From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest

10/14/2026 | I-Connect007
The October issue of Advanced Electronics Packaging Digest examines the technologies, investments, and strategic decisions shaping the future of advanced electronics manufacturing. From the evolution of semiconductor scaling and the integration challenges of high-frequency systems to the expansion of semiconductor capabilities in the United States and India, this issue explores how materials, packaging architectures, and manufacturing infrastructure are becoming interconnected.

October SMT007 Magazine Examines Automotive Soldering Reliability

10/01/2026 | I-Connect007 Editorial Team
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09/16/2026 | I-Connect007 Editorial Team
The September issue of I-Connect007 Magazine examines why employee experience and judgment remain essential as manufacturers bring more automation onto the shop floor. Industry experts share how companies can combine these strengths to improve processes without losing the knowledge behind them. Plus: We cover what's going on in the European PCB Design community.

Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

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Marcy’s Musings: A World of Difference

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I've spent a good deal of time in Asia over the years, both traveling and living there, so arriving in Thailand for THECA wasn't my first experience stepping into another culture or another way of doing business. Still, there is something about being there—moving through a different city, sitting down with people, listening to their conversations, and watching how they approach familiar challenges—that gets me thinking.
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