Flex Connections: Material Selection in Nickel vs. Copper Tabs
Flex Connections: Four Lessons in Engineering Judgment for PCB Designers
Flexible Thinking: ‘Let There Be Light’–Emitting Diodes!
Working from home really has its perks, especially when it comes to driving. I don’t miss the commute time, driving in the rain, or having to maneuver around everyone else going to work or coming home. Simply popping up to my desk in the morning is such a benefit.
But what I do miss is being physically with my coworkers and the interactions that can happen when you’re all together. You just don’t get the synergy over a Teams call that you can get in person. Even more, being together fosters a sense of camaraderie you can’t get any other way.
That’s why I really enjoyed our team-building conference with the Global Electronics Association last week. Not only did I get to see my I-Connect007 team in person, but I also became better acquainted with more of the folks helping run the Association. As you’ll learn in Brittany Martin’s column this week, there are tangible benefits to working together to solve a problem.
I’m also highlighting a new column by Echo Yang of Archer Circuits. We interviewed Echo a few years ago when she was just getting started, and now that she’s firmly established, she has returned to write for us on a regular basis. The October issue of I-Connect007 Magazine is out this week with some scary-good stuff, and we’re previewing the next issue of the Advanced Electronics Packaging Digest. Finally, I call your attention to an update on Electronics Day, a special one-day event that took place in Paris last month.
The Fearless Connector: Why I Chose the Hard Road
Published October 14
On Monday, we announced this upcoming column, which was published Wednesday in our SMT007 Week newsletter. It’s exciting to have 1) another female perspective in our columnist ranks; and 2) first-hand experience from a younger entrepreneur who’s excited about joining the industry and making her presence known. Echo shares that starting her own business wasn’t easy, and she had no guarantees for success. But she’s persevered, and we should all look forward to hearing more from her in the months to come.
The Marketing Minute: Marketing Is a Team Sport
Published October 14
Team-building exercises can feel contrived and awkward. But our scavenger hunt around Schaumberg, Illinois, on the most perfect Midwest fall day was quite a bit of fun. We worked together on many challenges, while also having opportunities for one-on-one conversations. The efforts we make to share the stories of the industry don’t work in a vacuum, shares Brittany Martin in her most recent column. “One of the biggest mistakes companies make is treating marketing as a department that operates independently of everything else.” Read this column to learn specific ways to integrate your marketing with the rest of your team.
October I-Connect007 Magazine Spotlights MKS and PCB Manufacturing Challenges
Published October 17
Managing Editor Marcy LaRont has published (in her words) another “frighteningly good” issue for October. I agree, so check it out! First, the magazine highlights the work of Dr. John T.C. Lee of MKS Inc., whose pioneering efforts are solving tough challenges across the supply chain. She also features three tours of Chinese companies finding great success in Thailand in a relatively short time. For fun, Marcy challenged her columnists to write about what’s “scaring” them in the industry right now. Their thoughts and ideas are scattered throughout the issue, so once you locate them, let us know if you agree with their sentiments.
From Resilience to AI Infrastructure: Key Insights From 2026 Electronics Day EMS Europe
Published October 13
Competitiveness, capacity, and capability: These words kept resurfacing during a special gathering in Paris of nearly 200 of Europe’s leading EMS suppliers last month. They came together at the invitation of the Global Electronics Association to discuss their unique challenges and opportunities. It’s no secret that Europe has struggled to maintain its footing in the electronics ecosystem, but the conversations frequently centered on how to stay resilient amid these challenges. What affects Europe affects the whole supply chain, so this is definitely a must-read.
From Substrates to Systems: A Preview of the October Advanced Electronics Packaging Digest
Published October 14
I’ve been working in the industry for about six years, and what I’ve noticed is how much our vocabulary has changed. When I first started editing copy, we weren’t regularly talking about chiplets, 2.5D and 3D integration, or bringing multiple semiconductor dies together in a single package. Now, these topics are part of everyday industry conversations. What I’ve come to appreciate is that advanced packaging isn’t just about making things smaller. It’s about making different technologies work together, from the silicon inside a package to the substrates, interconnects, and systems that support it. It’s changing how companies and countries think about their manufacturing capabilities. That’s why I find our monthly Advanced Electronics Packaging Digest so valuable. It helps connect the technical advances with the bigger industry picture. This month’s issue looks at everything from semiconductor scaling and high-frequency integration to investment strategies in the U.S. and India. Get a preview of next week’s issue here.
