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Heron Power, an American advanced power electronics manufacturer, announced it has selected Morgan Hill, California as the home of its first large-scale factory.

Advanced Electronic Packaging: The Industry's New Innovation Engine

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Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

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For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

Catching Up With FUJI PCB and FS Quality’s President, Mr. Tianming Liu

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I recently interviewed Mr. Tianming Liu, founder of FUJI PCB and FS Quality. His company is built by blending Japanese manufacturing discipline, Chinese execution speed, and an unwavering commitment to quality and customer service. His story is anything but ordinary. From studying and working in Japan for more than a decade to transforming a struggling PCB factory into a profitable operation before launching FUJI PCB, he has shown vision, determination, and continuous innovation.

Compal Opens Daxi AI Server Manufacturing Center

08/12/2026 | PRNewswire
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