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Advanced Electronics Packaging Digest

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Northrop Grumman to Advance Military’s Protected Satellite Communications

06/18/2026 | Northrop Grumman
Northrop Grumman Corporation will continue its work on advanced, jam-resistant satellite communications with an award to build a free-flying, Enhanced Protected Tactical Satellite Communications – Prototype (PTS-P) for U.S. Space Force Space Systems Command (SSC).

Airbus: France Launches Development of New Capabilities for A400M

06/16/2026 | Airbus
Airbus Defence and Space has signed a contract with OCCAR (Organisation for Joint Armament Cooperation), acting on behalf of the French Directorate General of Armaments (DGA), for the development of new capabilities for the A400M.

Lockheed Martin Secures $514M U.S. Space Force Contract for GPS IIIF SV23 & 24

06/16/2026 | Lockheed Martin
Lockheed Martin announced that the U.S. Space Force has awarded the company a $514 million contract to build Global Positioning System IIIF Space Vehicles 23 and 24, bringing its total GPS IIIF commitment to 14 spacecraft.

Chase Corporation Acquires Sheldahl

06/15/2026 | PR Newswire
Chase Corporation, a leading global provider of engineered materials for high-reliability applications, today announced it has acquired Sheldahl from Flex. Sheldahl designs and manufactures specialized coated films, laminates, and flexible circuit technologies for aerospace, automotive, industrial, and medical markets.

Spirit Electronics Opens U.S. Semiconductor Manufacturing Access for Aerospace and Defense

06/15/2026 | Globe Newswire
Spirit Electronics announced a new managed-access offering that provides aerospace and defense customers with a secure pathway to advanced, U.S.-based semiconductor manufacturing in 28nm CMOS.
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