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Advanced Electronics Packaging Digest

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Vertical Aerospace Makes History With First Public eVTOL Transition Flight at Farnborough International Airshow

07/20/2026 | Vertical Aerospace
Vertical Aerospace, a global aerospace and technology company pioneering electric aviation, today made history by completing the first public electric vertical take-off and landing (eVTOL) flight at Farnborough International Airshow, switching from helicopter mode to airplane mode and back again.

Technica USA to Host PCBA Lunch & Learn Featuring DCT and Rehm Thermal Systems

07/20/2026 | Technica USA
Technica USA has announced its next Lunch & Learn event for PCB assembly (PCBA) customers, scheduled for August 12 and 13. The educational sessions will feature technology experts from DCT and Rehm Thermal Systems, highlighting innovative equipment and process solutions designed to improve manufacturing performance.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

PCB People Reports Record-breaking First Half as PCB Supply Chain Pressure Intensifies

07/15/2026 | PCB People
Record first-half performance driven by surge in demand from Electronic Manufacturers supports rapid customer growth, with new customers up 30% and new part numbers up 36% year-on-year.

New York Imposes One-Year Moratorium on New AI Data Centers

07/15/2026 | I-Connect007 Editorial Team
New York has become the first U.S. state to impose a temporary statewide moratorium on new hyperscale data centers, following an executive order signed July 14 by Gov. Kathy Hochul. 
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