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Advanced Electronics Packaging Digest

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Suggested Items

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.

Sikorsky to Integrate MATRIX™ Autonomy into BETA Technologies’ MV250

07/20/2026 | Lockheed Martin
Sikorsky, a Lockheed Martin company, announced that it will integrate its proven MATRIX™ autonomy suite into BETA Technologies’ ALIA MV250 hybrid-vertical‑take‑off‑and‑landing (hVTOL) aircraft.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/17/2026 | Nolan Johnson, SMT007 Magazine
The Pentagon’s announcement on Tuesday that CMMC certification is being immediately suspended is the big news of the week. We’ve been covering the CMMC journey since the beginning, and we’ll stick with the story for the duration. If you’ve followed my list of must-reads, you know that I’m always interested in semiconductor news, and this week had a few good ones. I’ll mention them here, and urge you to read the entire stories: Apple adds to the recent Intel fab agreement by adding to its U.S.-based design and manufacturing agreement with Broadcom; Micron is investing $3 billion to the U.S. semiconductor ecosystem; and Intel announces a 5 billion euro investment in European infrastructure.

Meet the Author Podcast: Exploring the Growing Role of UV Curable Conformal Coatings with Dow

07/13/2026 | I-Connect007
UV curable conformal coatings are gaining momentum for good reason. Faster processing, simplified manufacturing, and improved reliability have made the technology an attractive option for electronics manufacturers looking to improve production without sacrificing performance. In the latest Meet the Author podcast from I-Connect007, Managing Editor Nolan Johnson welcomes Brian J. Chislea and Cody Schoener, PhD, of Dow, Inc. to discuss their new book, The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings.

Alpha, Omega Semiconductor Unveils AmpStack Packaging

07/08/2026 |
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DFN6x5 AmpStack™ MOSFET package.
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