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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

07/23/2026 | PR Newswire
Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India's semiconductor journey.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.

Meet the Author Podcast: Bert Horner on Design for Test

07/23/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Episode 7 of the “Meet the Author” podcast, featuring Bert Horner, president of TTCI, discussing his new book, The Printed Circuit Assembler's Guide to... Design for Test. In this conversation with Nolan Johnson, Horner explores what he calls the "Butterfly Effect" of Design for Test (DFT): Decisions made early in the design process can significantly influence manufacturing success, product reliability, and long-term profitability.

Siemens to Acquire Defacto Technologies to Bolster EDA Portfolio

07/21/2026 | Siemens
Siemens announced that it has entered into an agreement to acquire Defacto Technologies, a privately held EDA software company active in the register-transfer level (RTL) design field focused on automated SoC design creation and integration.

Foxconn Debuted Smart EVs and AI Modular Data Center at Japan-Taiwan Exhibition

07/21/2026 | Foxconn
Organized by the Foreign Trade Administration of Taiwan's Ministry of Economic Affairs and run by the Taiwan External Trade Development Council, the 2026 Japan-Taiwan Image Exhibition carried the theme "Innovate for Tomorrow: Taiwan and Japan Creating a Better Future Together."
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