Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Follow the Story: How to Increase Your Supply Chain Intelligence

07/10/2026 | I-Connect007 Editorial Team
For years, supply chain management was largely about efficiency: securing materials, managing inventory, and delivering products on time. Today, it's much more complex. First, AI is reshaping demand forecasting and materials sourcing. We also feel the impact of trade policies on manufacturing decisions, and government advocacy efforts are shaping the business environment for electronics companies worldwide. Understanding these forces and how they connect is becoming a competitive advantage.

China’s Export Engine Keeps Accelerating Despite Global Turbulence

06/09/2026 | I-Connect007
China’s export sector continued to outperform expectations in May, with outbound shipments rising 19.4% year over year to US$376.8 billion, according to customs data released Tuesday. The result significantly exceeded economists’ forecasts and marked an acceleration from April’s already strong growth.

American Made Advocacy: Five Years of Educating, Advocating, and Influencing Legislation and Policy

05/26/2026 | Shane Whiteside -- Column: American Made Advocacy
Five years ago, five companies decided that the PCB industry needed its own voice in Washington. The Printed Circuit Board Association of America was created largely in response to the fact that PCBs were not included in the CHIPS Act legislation.

Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity

05/08/2026 | Global Electronics Association
Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.

Lapse of Key Digital Trade Measure Undermines Economic Growth, Innovation

04/03/2026 | SIA
Semiconductor Industry Association (SIA) President and CEO John Neuffer expressed disappointment trade negotiators from around the world failed to reach an agreement to permanently prohibit duties on digital trade during last week’s World Trade Organization (WTO) Ministerial Conference in Yaoundé, Cameroon.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in