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Advanced Electronics Packaging Digest

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Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

08/14/2026 | Marvell Technology, Inc.
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced new innovations across its AI memory infrastructure portfolio, advancing its position spanning server-level AI storage, rack-scale CXL memory expansion and pooling, and pod-level optical shared memory.

Micron Ventures Launches $250 Million Fund to Invest in the Next Generation of AI

08/14/2026 | Micron
Micron Technology, Inc. launched the Micron Ventures Paradigm Fund, a $250 million investment vehicle built to partner with the companies shaping the future of AI.

iPhone 18 Pro BOM Cost Expected to Surge Nearly 40%, Leaving Apple to Sacrifice Margins to Sustain Shipments

08/10/2026 | TrendForce
TrendForce’s latest smartphone industry research reveals that escalating component costs—led by memory—are expected to significantly raise production expenses for Apple’s next iPhone 18 series.

Netlist Announces Strategic Alliance with Samsung For Advanced Memory Technology

08/06/2026 | PRNewswire
Netlist, Inc. announced a strategic alliance with Samsung with the signing of five-year term agreements for a patent portfolio cross license, memory product supply and technology cooperation.

Kioxia, Sandisk Develop Highest-Density 3D QLC NAND

08/06/2026 | BUSINESS WIRE
Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation and Sandisk Corporation unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency.
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