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Amphenol Printed Circuits (APC) will once again be bringing examples of their printed circuit board (PCB) design and manufacturing skills to the RF/microwave industry’s major annual technology event, 2026 IEEE MTT-S International Microwave Symposium (IMS), June 9–11, at the Thomas M. Menino Convention & Exhibition Center in Boston.
Exhibiting as part of Booth #16054, APC will offer visitors detailed views of high-performance PCBs, including ruggedized RF/microwave applications and high-speed-digital (HSD) circuits.
APC will provide examples of high-performance PCBs for terrestrial, maritime, and space applications, fashioned with its flex, rigid, and rigid flex circuit materials. Boards cover a wide range of applications, from tiny surface-mount-technology (SMT) assemblies supporting reduced size, weight, and power (SWaP) requirements to special large-format projects. One of these larger assemblies is over 40 inches in length but features tightly amplitude- and phase-matched channels to support the most demanding radar and satellite requirements.
Colby Hobart, APC’s RF Applications Engineer, will be at Booth #16054 to update visitors about APC’s advanced circuit materials and technologies. As Hobart explains: “Most engineers are searching for ways to make things smaller, such as for reduced SWaP. But we have also had design and manufacturing inquiries for PCBs headed in the opposite direction. We will be showing examples of large-format PCB assemblies based on advanced materials that meet challenging amplitude and phase specs as required for radars, satellites, and other systems with densely populated PCBs.”
