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Advanced Electronics Packaging Digest

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Suggested Items

The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

Lam Research, NY CREATES Partner to Train Future Semiconductor Workforce

08/12/2026 | PRNewswire
Lam Research Corp. and New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY Creates) announced a collaboration to enable the training of approximately 3,500 students in semiconductor process integration over the next five years.

SpaceX, Tesla Plan Massive Texas Semiconductor Facility to Support AI, Space Technologies

08/07/2026 | I-Connect007 Editorial Team
SpaceX and Tesla have announced plans to build Terafab, a large-scale semiconductor manufacturing facility in Grimes County, Texas, aimed at expanding domestic production of advanced logic and memory devices for artificial intelligence, autonomous vehicles, robotics, and space applications.

AS9100D and PCB Fabrication: What Supplier Quality Should Evaluate

07/28/2026 | Ryan O’Connor, SOMACIS
When a supplier quality engineer supporting aviation, space, or defense programs reviews a new PCB fabricator, one of the first checkpoints is simple: Is the AS9100D certificate current? That is an appropriate starting point. In regulated aerospace environments, configuration control, traceability, corrective action, and internal audit discipline are not optional. The standard establishes the quality management structure that those programs depend on. The more consequential evaluation begins after certification is confirmed. In multilayer and rigid-flex fabrication, performance reliability is shaped by how engineering review and process controls are executed day to day.

The Right Approach: The Pros and Cons of PCB Vertical Integration

07/21/2026 | Steve Williams -- Column: The Right Approach
Vertical integration in PCB fabrication is a genuinely contested strategic question with real tradeoffs on both sides. The core tension: Fabricators integrate up into design and down into assembly to gain margin and stickiness, but risk diluting their manufacturing focus and alienating the EMS and design-house partners they depend on.
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