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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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I-Connect007 Observes Labor Day Holiday With Office Closure

09/04/2026 | I-Connect007
In the U.S, the Labor Day holiday arrives as the unofficial end to summer, but its roots run much deeper (and a little darker, if you’re a student of U.S. history) The first observance was held in New York City on Sept. 5, 1882, when thousands of workers marched in a parade organized by the Central Labor Union. Numerous states recognized Labor Day prior to Congress establishing it as a federal holiday in 1894. At its heart, the contemporary Labor Day holiday recognizes the workers whose skill, persistence, and ingenuity have built the nation’s prosperity.

ITAR vs. EAR: When PCB Fabrication Can Move Outside the U.S.

08/31/2026 | Ryan O'Connor, SOMACIS
The difference between ITAR and EAR is often reduced to a simple rule of thumb: ITAR programs must stay in the U.S. (exceptions apply), while EAR programs can be built anywhere. In practice, that distinction is incomplete and often leads to sourcing decisions that introduce compliance risk rather than reducing it. Whether a PCB can be fabricated outside the United States depends not just on whether it is ITAR- or EAR-controlled, but on how the program is classified, what data is involved, who can access it, and how fabrication is executed across locations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/28/2026 | Nolan Johnson, I-Connect007
This week, the Global Electronics Association published its monthly report on PCB fabrication and EMS bookings and shipments, and the numbers are extremely positive. In EMS, the three-month book-to-bill ratio stands at 1.29 for July. Year-to-date EMS bookings are at 11% over 2025. The picture is similar in PCB fabrication as well. Year-to-date bookings are up 33% over last year, and book-to-bill stands at 1.46.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

PewCB One Desktop PCB Prototyping System

08/24/2026 | PewCB
PewCB has unveiled the PewCB One, a desktop PCB prototyping system designed to significantly accelerate hardware development. Production of the device is scheduled to begin on September 1 in Guangzhou.
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