Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

PC GPU Shipments Rise 10.4% QoQ, 1.1% YoY

09/04/2026 | Jon Peddie Research
Jon Peddie Research reports the global PC-based graphics processor unit (GPU) market in Q2'26 grew to 75.5 million GPUs, an increase of 10.4% quarter to quarter and 1.1% year over year, while PC CPU shipments decreased -1.1% year over year.

Real Time with... THECA 2026: Global Electronics Association on PCB Growth, Standards, and Emerging Technology

09/04/2026 | Real Time with... THECA
David Bergman, VP of International Relations at the Global Electronics Association, talks with Marcy LaRont about his privilege in being involved in THPCA from early on and the strategic opportunity for the Association to make a difference in Thailand's growing electronics industry through standards and education. Also as an active member of the Electronic Circuit World Council (ECWC) (which occurs every three years) Mr. Bergman discusses plans for ECWC17 which will take place next year with THECA 2027, highlighting Thailand's role in electronics manufacturing.

Battalion Advanced Technology, Penn State Launch National Security Research Collaboration

09/02/2026 | PRNewswire
Penn State and Battalion Advanced Technology Ltd, have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high temperature materials that aim to enable next generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.

THECA 2026 Review: Innovating PCBs and Advanced Electronics

08/31/2026 | Marcy LaRont, I-Connect007
The Thailand Printed Circuit Association hosted its third annual trade show in the bustling city of Bangkok this past week, under the theme “Innovating PCB and Advanced Electronics with Next-Gen Packaging.” Building on its success as a leading PCB industry exhibition, THECA has brought together the entire PCB value chain, creating a comprehensive platform for advanced electronics.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in