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Advanced Electronics Packaging Digest

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Iris Technology Secures Strategic Investment from OceanSound Partners

10/29/2026 | BUSINESS WIRE
OceanSound’s investment to strategically transform Iris into a leading independent provider of qualified electronics to national security space missions

Kratos Breaks Ground on New AN/SPY-1 Radar and Helios Hypersonics Testing Facilities in Indiana

10/15/2026 | Globe Newswire
Kratos Defense & Security Solutions, Inc., a technology company in defense, national security, and global markets, today celebrated a joint groundbreaking ceremony, at the Westgate Academy in Odon, Indiana, marking the beginning of construction for its new Helios and AN/SPY-1 facilities.

Flex PCB Body Panels in CubeSats

10/08/2026 | Anaya Vardya, American Standard Circuits
A standard CubeSat (nanosatellite) leaves an engineer with almost no room for compromise. A 1U unit is a 10 cm cube; even a 6U or 12U bus measures its budget in grams and cubic centimeters, not the kilograms and racks available to a traditional satellite. Every wire harness, connector, and mounting bracket is mass and volume that could otherwise carry a sensor, a radio, or extra battery capacity. That pressure is what has pushed flexible printed circuits out of the wiring harness and onto the structure itself, turning the body panels that form a CubeSat's outer skin into functional electronic assemblies.

Siris to Acquire 19.1% Stake in Agfa-Gevaert from Active Ownership

09/28/2026 | Agfa-Gevaert
Agfa-Gevaert NV announced that Siris Capital Group has signed a strategic investment in Agfa-Gevaert NV to acquire a 19.1% stake currently held by Active Ownership. Terms of the transaction were not disclosed.

Teradyne Introduces Iris 100 MicroLED Test System

09/21/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced Iris 100, a production-ready optical test platform for microLED devices.
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