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From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation

05/06/2026 | I-Connect007
I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.

Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026

04/23/2026 | Remtec
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience

04/16/2026 | I-Connect007 Editorial Team
I-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.

Technica Announces Tech Day Event Dates and Agenda

04/13/2026 | Technica USA
Technica USA announced today the return of its highly anticipated Tech Day events, marking the revival of a long‑standing customer engagement series. Personal invitations have been issued to customers detailing event dates, participating partners, and the technical agenda.

Wire Harness Taking a Step in the Right Direction

04/08/2026 | Nolan Johnson, SMT007 Magazine
To fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.
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