Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

SEMI Calls for Chips Act 2.0 to Boost Semiconductor Competitiveness

09/14/2026 | SEMI
SEMI renews its call on European policymakers to use the proposed Chips Act 2.0 to strengthen Europe’s semiconductor competitiveness, reinforce supply chain resilience, and create the conditions needed to attract and sustain investment across the entire semiconductor value chain.

Intel Foundation, PLTW Expand Pathways to Semiconductor Careers

09/14/2026 | Intel Corporation
The future of semiconductor innovation depends on a strong pipeline of skilled talent.

Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

MacDermid Alpha Highlights Silver Alternative Die Attach for Cost-Stable Semiconductor Manufacturing at SEMICON India 2026

09/10/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at SEMICON India 2026, September 17–19, at Yashobhoomi, the India International Convention and Expo Centre (IICC), in Dwarka, New Delhi. Visitors can meet the company at Booth H6807 to discuss ALPHA® ATROX® CD 560-1, a PFAS-free silver alternative conductive die attach paste for metal leadframe semiconductor packages.

Samsung Electronics, ASML Expand Semiconductor Collaboration

09/10/2026 | BUSINESS WIRE
Samsung Electronics and ASML announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies that will help drive the next generation of innovation in the AI era.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in