The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
SEMI Europe Outlines Six Key Recommendations to Strengthen Chips Act 2.0
April 28, 2026 | SEMIEstimated reading time: 1 minute
SEMI Europe announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing and future-proofing Europe’s semiconductor policy framework. While the first European Chips Act represented a significant milestone for the region’s semiconductor ecosystem, SEMI Europe now calls on policymakers to address the structural challenges that could constrain its long-term impact.
“Research and product development, chip design, equipment, materials, fabrication and advanced packaging are all interconnected elements of a single ecosystem—one in which success relies on every component functioning in harmony,” said Laith Altimime, President of SEMI Europe.
Building on this perspective, SEMI Europe emphasizes that the effectiveness of the Chips Act 2.0 will depend on its capacity to strengthen capabilities across the entire semiconductor value chain—from design and materials to equipment, as well as front-end and back-end manufacturing. Achieving this will require a revision of the “First-of-a-Kind” definition and an expansion of the Pillar II framework to better reflect the full breadth of the industry.
The position paper also highlights the need to translate Europe’s strong research base into tangible industrial outcomes. To address this structural gap, SEMI Europe advocates for increased industry participation in EU-funded R&D programmes, the creation of dedicated industrialisation initiatives, and the development of tailored instruments to support smaller, innovative players.
Finally, to position the Chips Act 2.0 as a truly strategic instrument, closer alignment with other legislative frameworks will be essential, ensuring its integration into a broader EU technology strategy. Complementary measures—such as targeted tax incentives, reliable access to water and energy resources, and the establishment of a dedicated governing body—will be critical in enhancing Europe’s attractiveness as a destination for semiconductor investment.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Signal Integrity Meets Additive Innovation in the Latest Issue
05/18/2026 | I-Connect007 Editorial TeamSignal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.
MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026
05/15/2026 | MacDermid AlphaAs volatile silver prices continue to place pressure on semiconductor packaging costs and supply chain predictability, MacDermid Alpha Electronics Solutions will highlight material strategies that help manufacturers reduce dependence on silver without sacrificing reliability, thermal performance, or manufacturing efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
TSMC to Sell 8.1% of Vanguard International Semiconductor
05/15/2026 | TSMCTSMC plans to execute the sale of up to 152.0 million common shares of Vanguard International Semiconductor Corporation (VIS), or approximately 8.1% of VIS’ fully-diluted paid-in-capital through a block trade to financial institutional investors.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.