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Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Flex, Teradyne Robotics Expand Partnership for Global Smart Manufacturing Automation
April 22, 2026 | PRNewswireEstimated reading time: 2 minutes
Flex and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing. Under the expanded relationship, Flex plays a dual role by deploying Teradyne Robotics solutions within its own production facilities while manufacturing key robotics components that enable scalable automation deployments for Teradyne Robotics customers worldwide.
Teradyne Robotics brands Universal Robots (UR) and Mobile Industrial Robots (MiR) play a central role in the partnership. Flex manufactures key components for UR while deploying its collaborative industrial robots (cobots) and MiR autonomous mobile robots (AMRs) in Flex production environments. The combination of manufacturing and real-world deployment provides continuous operational feedback, validating robotics technologies at scale and enabling faster replication of successful automation workflows.
"For more than 20 years, Flex and Teradyne have partnered to deliver semiconductor equipment at global scale," said Dennis Kirkpatrick, President of Lifestyle, Consumer Devices, and Core Industrial, Flex. "Expanding our relationship into robotics and intelligent automation builds on a strong foundation, combining Teradyne Robotics' industry-leading technologies with Flex's advanced manufacturing capabilities, global footprint and execution expertise."
Flex supports Teradyne with advanced manufacturing, systems integration and global supply chain execution for semiconductor test platforms used across electronics and semiconductor production environments. Extending the partnership into manufacturing automation solutions reflects a natural evolution, leveraging shared expertise to address rising complexity, scale requirements, and the need for greater flexibility across modern production operations.
"Working closely with Teradyne Robotics as an automation partner allows us to scale intelligent automation while supporting increasingly complex manufacturing environments for customers in electronics, industrial equipment, data center infrastructure and other critical sectors," said Rodrigo DallOglio, President of Operational Excellence & Transformation, Flex.
Teradyne Robotics and Flex deliver next-generation intelligent automation applications that incorporate physical AI technologies designed to enable more adaptive, flexible solutions within increasingly complex production environments.
"Flex's experience in manufacturing complex products across industries, combined with its global scale and resilient supply chain, makes it an ideal partner for advancing intelligent automation," said Jean-Pierre Hathout, President of the Teradyne Robotics Group. "Together, we're accelerating the adoption of robotics technologies that improve productivity, flexibility and operational resilience across manufacturing environments worldwide."
As part of its ongoing work to advance next generation automation, Teradyne Robotics is integrating emerging physical AI technologies into its collaborative industrial robots and AMRs to help manufacturers address growing operational complexity. By combining these capabilities with Flex's manufacturing expertise and real-world deployment environments, the two companies are accelerating the validation and scaling of more adaptive, intelligent automation solutions that can respond to dynamic production needs and improve consistency, throughput, and efficiency across applications and global facilities.
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Cirtronics Brings Commercialization Discussion to Robotics Summit & Expo 2026
05/14/2026 | CirtronicsCirtronics, a leading electronics contract manufacturer specializing in complex robotics systems, will sponsor and lead a featured panel discussion at the 2026 Robotics Summit & Expo, taking place May 27–28 at the Thomas M. Menino Convention & Exhibition Center in Boston.
Infineon Startup Challenge 2026 Puts Humanoid Robotics in the Spotlight
05/11/2026 | InfineonInfineon's Startup Challenge brings together promising founder teams and young high-tech companies from across the globe to work jointly on a highly relevant topic: humanoid robotics.
Rocket Lab To Acquire Robotics Leader Motiv Space
05/08/2026 | Globe NewswireRocket Lab Corporation, a global leader in launch services and space systems, announced it has signed a definitive agreement to acquire Motiv Space Systems, a California-based company specializing in space robotics, motion control systems, and precision mechanisms for spacecraft.
China Makes AI-powered Robots Core of National Strategy
05/05/2026 | IFRChina has launched its 15th Five-Year Plan by placing robotics at the heart of its modern industrial system.
ARX Robotics, Supacat Partner on UK Uncrewed Systems
04/29/2026 | ARX RoboticsARX Robotics UK has begun manufacturing autonomous ground systems in the United Kingdom following its first contract with the British Army.