Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Cadence Reports Q2 2026 Financial Results

07/28/2026 | Cadence Design Systems
Revenue of $1.584 billion, compared to revenue of $1.275 billion in Q2 2025.

Rapidus, Cadence Partner on Agentic AI for Advanced SoC Design

07/20/2026 | Cadence Design Systems
Rapidus Corporation and Cadence announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads).

Cadence Launches AuraStack AI Super Agent

07/16/2026 | Cadence Design Systems, Inc.
The AuraStack AI Super Agent is the world's first agentic AI platform for PCB and advanced packaging design.

Cadence Accelerates Digital Twin–Driven Data Center AI Modernization with HPE

06/17/2026 | Cadence Design Systems
Cadence announced an expansion of its collaboration with HPE to accelerate digital twin-driven data center modernization, enabling customers to improve planning, optimization, and lifecycle operations for next-generation AI and high-performance computing (HPC) infrastructure.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in