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Suggested Items

The Chemical Connection: More Solutions to Common PCB Etching Questions

09/09/2026 | Don Ball -- Column: The Chemical Connection
Rather than pontificating at great length on a subject I know nothing about, although I have been known to do this on occasion (the scientific term for this is “baffling them with bull****”), I decided to comment on some basic questions and problems that keep popping up in spite of them having been around forever and having known solutions. Most of the inquiries come from the new process engineers who are being promoted as the older, more experienced process engineers retire. They’re so basic that the older people don’t even think about them anymore, let alone pass the knowledge on, so when these questions or problems arise, the new people are unaware that there are explanations and/or solutions.

Trouble in Your Tank: Pre-electroless Causes of Voids

09/02/2026 | Michael Carano -- Column: Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it more difficult to achieve a continuous, void-free copper deposit. Drilling these thicker panels and higher aspect ratio vias adds another layer of complexity. Since there are many potential causes of PTH voiding, I’ll focus on pre-electroless copper causes, including drilling.

The Chemical Connection: Back to Basic Cupric Chloride Etching

07/08/2026 | Don Ball -- Column: The Chemical Connection
We have received several calls in the past few months from younger process people who have been thrust into more senior process positions as their older colleagues retire. They’ve realized they lack the practical knowledge their predecessors have accumulated over the years. They know what their various process parameters are, but not why those particular parameters were in place. I found that the most frequently asked questions have been about cupric chloride etch chemistries. Therefore, I will cover the very basics of cupric chloride etching; not so much the technical facts but why we give the advice we do.

Chemcut Delivers XLi Ferric Chloride Etch System to Texas Nameplate

06/30/2026 | Chemcut Corporation
Chemcut Corporation, the leading U.S. manufacturer of wet processing equipment, is proud to announce the successful delivery and installation of a state-of-the-art XLI Ferric Chloride Etch system to Texas Nameplate Company (TNC) in Lancaster, Texas.

Follow the Story: The Chemistry Behind PCB Fabrication

06/16/2026 | I-Connect007 Editorial Team
Many of the decisions that shape reliability, yield, sustainability, and cost happen long before a board reaches final inspection. The choice of metallization process, surface finish, water treatment strategy, or etching approach can significantly impact manufacturing outcomes. Here are four articles worth revisiting that tackle different aspects of the same conversation: the chemistry and processes behind modern PCB manufacturing.
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