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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EMI Promotes David Vue to Lead Military and Aerospace Division
March 31, 2026 | Express Manufacturing Inc.Estimated reading time: 2 minutes
Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, announced the promotion of David Vue to Military and Aerospace Division Manager.
Vue joined EMI in 2016 and has progressed through several roles of increasing responsibility, including Associate Manufacturing Engineer, Manufacturing Engineer, and Senior Manufacturing Engineer. Although he entered the manufacturing industry without prior experience, he quickly developed his expertise through hands-on work and mentorship within the organization.
In his new role, Vue will support the continued growth of EMI’s Military and Aerospace Division while leading the production team and engineering staff and overseeing operations for the division’s dedicated production facility. His responsibilities include managing and developing the manufacturing engineering team, overseeing daily operations and production schedules, and approving final engineering quotes.
“Since joining EMI in 2016, David has made significant contributions across both technical and sales support functions and has played a key role in the growth of our Military & Aerospace division,” said Reed Chan. “I’m excited to see him take on this new leadership role.”
For more than 40 years, EMI has supported mission-critical defense programs with a focus on zero-defect manufacturing and strict regulatory compliance. The company specializes in printed circuit board assembly (PCBA), electromechanical systems, and low-volume, high-mix production, supported by ITAR-compliant and AS9100D-certified U.S. facilities.
EMI’s aerospace capabilities span applications including avionics, flight control systems, satellite communications, and unmanned aerial vehicles (UAVs). Its manufacturing approach emphasizes ruggedized designs, advanced testing protocols, and process control to meet the performance and reliability demands of these environments.
“I’m grateful to the Chin family and EMI management for their trust and continued support,” said Vue. “EMI gave me my first opportunity in the manufacturing industry, and I’m committed to building on that foundation by contributing to the company’s continued growth and success.”
With this leadership transition, EMI continues to invest in internal talent while strengthening its ability to support customers operating in highly regulated, high-reliability sectors.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
Foxconn, ElectroMobility Poland in Strategic Partnership to Develop Electric Vehicle Ecosystem
05/08/2026 | FoxconnHon Hai Technology Group (Foxconn) plans to accelerate the development of clean mobility in the European region in strategic partnership with state-backed ElectroMobility Poland S.A. (EMP), the key driver of an ambitious initiative to raise the technological and operational capabilities of the electric vehicle ecosystem in Poland and the broader region.
Flex Plans Cloud and Power Unit Spin-Off
05/08/2026 | FlexFlex announced that its Board of Directors has unanimously approved moving forward with a plan to spin off its Power and Cloud portfolio from Flex, creating two independent, publicly traded companies, each optimally positioned to serve their customers and create value for their shareholders.
Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.