Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

A Case Study in Conquering High Aspect Ratio Features

07/06/2026 | Richard Nichols, GreenSource Engineering
As demand for high-performance electronics is further driven by advances in AI and machine learning, the importance of high aspect ratio (HAR) through-holes in PCBs and IC substrates has become increasingly apparent. These vias play a vital role in enabling vertical interconnections in complex circuit architectures, especially within HDI structures, where maximizing space and enhancing electrical performance are crucial.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/03/2026 | Nolan Johnson, SMT007 Magazine
Today is a holiday in the U.S., the 250th anniversary of the signing of the Declaration of Independence, the document that launched the 13 British colonies on the path to becoming an independent country. The news, however, continues regardless of the day or the country being celebrated. Here are my top picks for the week. This week, I’m drawing attention to three news items on the shifting component supply chain balance. I’ve also selected the July issue of SMT007 Magazine on setup time optimization, and Steph Chavez’s column on digital twins.

Kingboard Raises $1.5 Billion Through Kingboard Laminates Stake Sale to Support PCB Expansion

06/17/2026 | I-Connect007 Editorial Team
Kingboard Holdings has raised approximately HK$11.77 billion (US$1.5 billion) through the sale of a portion of its stake in subsidiary Kingboard Laminates Holdings, as growing demand from AI infrastructure drives investment across the PCB and electronics materials supply chain.

China’s Export Engine Keeps Accelerating Despite Global Turbulence

06/09/2026 | I-Connect007
China’s export sector continued to outperform expectations in May, with outbound shipments rising 19.4% year over year to US$376.8 billion, according to customs data released Tuesday. The result significantly exceeded economists’ forecasts and marked an acceleration from April’s already strong growth.

The AI Tipping Point: Transforming Global Material Supply Chains

06/01/2026 | Marcy LaRont, I-Connect007 Magazine
While the AI revolution has the world focused on the promise of solving our most complex challenges, some laminate and PCB fabricators are raising concerns that the high-performance materials used to build AI data centers will gobble up the precious resources needed to produce them. PCB industry expert Mark Goodwin, COO of Ventec International, a laminate and equipment supplier, has expressed his concerns about the critical shortage of glass and copper, which he believes will worsen.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in