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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IC-Link by imec Expands TSMC Collaboration for Advanced-Node Chip Design

10/01/2026 | Imec
IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities.

Infineon Opens New Backend Manufacturing Hub in Thailand

10/01/2026 | Infineon
Infineon Technologies AG officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan, together with Anutin Charnvirakul, Prime Minister of Thailand and Alexander Gorski, Chief Operations Officer of Infineon Technologies.

HBM, Advanced Packaging and Cooling Market Set for Growth Through 2037

09/30/2026 | Globe Newswire
High-bandwidth memory (HBM) and advanced packaging materials are becoming critical components of the artificial intelligence semiconductor supply chain.

VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore

09/28/2026 | Globe Newswire
VisionPower Semiconductor Manufacturing Company Pte. Ltd. (VSMC), the joint venture established in September 2024 by Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors N.V., marked the grand opening of its first 12-inch (300mm) fab in Tampines, Singapore.

MKS Atotech Highlights Everplate Cu 300 2TF for Advanced Packaging

09/28/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, highlighted Everplate Cu 300 2TF from its Atotech brand.
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